HexaTech, Inc. announced the acceleration of its 100 mm diameter single crystal aluminum nitride (AlN) substrate product development program. The program will be supported with a significant investment in human resource and capital expenditures.
Gregory Mills, HexaTech vice president of business development, noted: “The 100 mm diameter AlN product in development is targeted at supporting the rapidly expanding deep UV optoelectronic commercial market, the needs of the nascent AlN-based power and RF device development efforts. This capability will deliver not only a dramatic improvement in price per unit area allowing for lower device costs but will integrate well with established customer fabrication lines already operating at 100 mm.”
“HexaTech’s history of developing and delivering AlN material with industry-leading structural and surface quality serves as a reliable foundation for scaling our AlN PVT growth process to larger diameters, while maintaining our established quality standards. Based on our proven technology, we fully expect to sustain these capabilities as we move towards a 100 mm product,” said HexaTech co-founder and chief technology officer Dr. Raoul Schlesser.
“With this strategic program focused on substrate diameter expansion, coupled with the substantial financial investment to support it, HexaTech once again demonstrates its commitment to advance the state-of-the-art in AlN substrate technology,” commented HexaTech CEO, John Goehrke.
Goehrke added, “The HexaTech team strives to continuously deliver market leading AlN products, providing our customers a superior AlN substrate solution.”
All of HexaTech’s 2-inch diameter products are available now with standard lead times.